Click on any chart to enlarge
- Chart 1 Desktop test results for 765 independent tests
- Chart 2 Desktop thermal compound comparison
- Chart 3 Multi platform comparison
Run Longer with Superior Reliability
It is well understood that the most (65% ) common electronic failures arise from thermal cycling .
Repeated thermal cycling and thermal shocks will, over a period of time, cause a mechanical
break in one of the components or interconnects rendering the entire system inoperable. IC
DiamondTM provides protection against this sort of thermal-mechanical failure; it is your systems
first line of defense. ....more
PlaystationTM heat sink thermal grease failure after only light use for a year. Photo shows loss of approximately 50% of useful thermal contact area. With IC Diamond you will never see this kind of failure.
• "8o C drop at load, this is incredible."
• "I have a 7o C drop in temps using this stuff. Fantastic!!!"
• "I must say from what I've seen so far I'm sold and this stuff is easier to clean up than normal silver based thermal paste."
• "Pretty nice gain! Not much change at idle but who cares, saving 3.1C at load is nice
considering that most of us, including myself, have spent hundreds over the years to
accomplish less."
• "Overall temp drop from ASC to IC7 was pretty impressive.”
• "I didn't expect extremely high temps considering my CPU isn't exactly highly overclocked. It's even more impressive considering that I'm not producing that much heat and yet I'm still able to see a difference in temps."
Run Cooler with Superior Performance
IC DiamondTM Thermal comound contains 92% micronized synthetic diamond, diamond is truly nature’s thermal super conductor with 500% better conductivity than it's nearest competitor silver. In the electronics industry, the efficient dissipation of heat is a necessity to manage the ever increasing thermal loads. As a result of the strong covalent bonds between the carbon atoms in a diamond crystal, diamond’s extraordinary conductive properties make it the ideal material for any high stress thermal applications.
Widely recognized and accepted by industry experts, diamond’s exceptional attributes such as its high resistance to thermal shock, high electron mobility, high conductivity, and it chemical inertness make it a suitable material for the dissipation of heat in the semiconductor manufacturing industry.
IC DiamondTM contains micronized synthetic diamond in the highest concentration of diamond in any compound available on the market today. Each single crystal micronized particle has the same extraordinary thermal properties you would find in a larger industrial diamond.....More