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Independent User Thermal
Testing
232 Independent users in
seven different forums used their own PCs to test the difference
between IC Diamond and other thermal compounds. This independent
testing shows an average performance gain of 3.21 ºC over other
thermal compounds |
Independent User Pressure and Contact Testing
As a continuation of work to
better understand the dynamics
impacting thermal grease performance, tests were conducted by users
in four different forums using contact pressure film from Sensor Products
to evaluate thermal performance as it relates to contact and
pressure |
Application
Instructions and
Notes
IC Diamond has undergone considerable user testing
combined with Innovation Cooling's own studies to optimize
performance along with ease of application. It is highly recommended
that you use our procedure and no others for best
results
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Reliability
IC Diamond was
originally designed as a high reliabilty T1 compound for use between
the IHS and CPU. IC Diamond is highly bulk loaded with over 92%
micronized diamond particles to limit pump out due to thermal
cycling.
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