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IC SI Thermally Conductive  Pad

Notable for its high performance and high durability, the IC SI Thermally Conductive Pad is designed to operate continuously at 140C. IC SI also has exceptional mechanical and physical characteristics. Surfaces are pliable to allow complete surface contact to enhance heat dissipation. Innovation Cooling Custom die cuts this 3M (5519) product for both retail (Sold as IC SI) and commercial use to suit your application.

  • Very high thermal conductivity (4.9 W/m-K)
  • Hardness :Shore 00 = 70
  • Good softness and conformability even to non-flat surfaces
  • Slight tack allows pre-assembly. Good wettability for better thermal conductivity

 

Product Description

3M™ Thermally Conductive Silicone Interface Pad (TCSIP) 5519 is designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M TCSIP 5519 consists of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles, which helps provide enhanced thermal conductivity and excellent electrical insulation performance.

Key Features

  • Very high thermal conductivity and good electrical insulation properties
  • Good softness and conformability even to non-flat surfaces
  • Good electrical insulation properties
  • Good flame retardant, UL94 V-0 equivalent material
  • Compression relaxation properties help reduce pressure to electric components
  • Slight tack allows pre-assembly
  • Good wettability for improved and lower thermal resistance

Product Construction/Material Description

Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes.

3M™ Thermally Conductive Silicone Interface Pad 5519
Property Value
Color White
Base resin Silicone
Thickness 0.5 – 2.0mm*
Primary Filler Type Ceramic
Product Liner PET Film Liner

* Standard thickness range. Custom thickness options available up to 10mm. Contact your local 3M representative for more information.

3M™ Thermally Conductive Silicone Interface Pad 5519

PET Liner
Filled Silicone Elastomer
PET Liner

Applications

  • Integrated chip (IC) packaging heat conduction
  • Heat sink interface
  • Chip on film (COF) heat conduction
  • LED board thermal interface material (TIM)
  • HDTV integrated chip (IC)
  • General gap filling in electronic device

3M™ Thermally Conductive Silicone Interface Pad 5519

Application Techniques

Note: Be sure to read and follow the manufacturers’ precautions and directions when using solvents.

Substrate surfaces should be clean and dry prior to the thermal pad application to ensure best thermal performance.

A clean surface can improve the thermal performance of an application.

  • Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or fingerprints. Do not use “denatured alcohol” or glass cleaners, which often contain oily components. Allow the surface to dry for several minutes before applying the thermal pad. More aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.
  • Apply the thermal pad to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the thermal pad during its application.
  • Remove the release liner before application.
  • Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the thermal pads. Rigid substrates are more difficult to assemble without air entrapment as most rigid parts are not flat. Flexible substrates can be assembled to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrate can conform to the other substrates during application.

 

Typical Physical Properties and Performance Characteristics

Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Final product specifications and testing methods will be outlined in the products Certificate of Analysis

 

3M™ Thermally Conductive Silicone Interface Pad 5519
Property Methoda Value
Thermal Conductivity (W/m-K) ASTM D5470 5 W/m-K
Density (g/cm3, @ 25°C) ASTM D6111 3.1
Operating Temperature Range 3M test method -50°C to 140°C
Hardness Shore 00b Modified ASTM D2240 70 ~ 80
UL Flame Classc UL94 V-0
Dielectric Breakdown Modified ASTM D149 (3M test method) 2 kV/mm
Volume Resistivity ASTM D257 1.7 x 1014 Ohms

a Methods listed as ASTM are tested in accordance with the ASTM method noted bShore 00 results depend on test method and thickness of the sample tested. Typical results are in the 60-80 Shore 00 range @ 6 mm test thickness without the PET film. Ask 3M for more details on pad softness.

 

 

Storage and Shelf Life

The shelf life of 3M™ Thermally Conductive Silicone Interface Pads 5519 is 24 months from the date of manufacture when stored in the original packaging materials and stored at 21°C (70°F) and 50% relative humidity.

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