Innovation Cooling

Independent User Thermal Testing

127 Independent users in five different forums used their own PCs to test the difference between IC Diamond and other thermal compounds. This independent testing shows an average performance gain of 3ºC over other thermal compounds

Independent User Pressure and Contact Testing

As a continuation of work to better understand the dynamics impacting thermal grease performance, tests were conducted by users in four different forums using contact pressure film from Sensor Products to evaluate thermal performance as it relates to contact and pressure

Application Instructions and Notes

IC Diamond has undergone considerable user testing combined with Innovation Cooling's own studies to optimize performance along with ease of application. It is highly reccomended that you use our procedure and no others for best results

Reliability

IC Diamond was originally designed as a high reliabilty T1 compound for use between the IHS and CPU. IC Diamond is highly bulk loaded with over 92% micronized diamond particles to limit pump out due to thermal cycling.

News Release

PRODUCT ANNOUNCEMENT

IC Diamond Thermal Compound - Now Available in 7 and 24 Carat Tubes

IC Diamond is highly bulk loaded with over 92% micronized diamond particles, 94% fully bulk loaded counting other misc. particles. The highly loaded mix is required to limit pump out due to thermal cycling, basically the reasoning behind it is that it is harder to pump or bake out a solid than a lessor, lightly loaded liquid type compound grease.

Bake out and pump out are well known and documented as primary causes of grease failure. A viable or optimal compound is one that utilizes as little of any kind material (liquids)as possible that would be the central cause of of a TIM joint failure, while at the same time maintaining the best thermal performance possible. With the introduction of IC Diamond Thermal Compound we believe we have managed all the criteria for an optimal TIM by combining both performance and reliability. Effectively suitable for the system builder, performance hobbiest or OEM customer

Diamond's 5 X better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and capacitive.