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Independent User Thermal
Testing
652
Independent users in 117 different forums used their own PCs to test
the difference between IC Diamond and other thermal compounds. This
independent testing shows an average performance gain of 4.04 ºC
over other thermal compounds |
Pressure
and Contact
Testing
As a continuation of work to
better understand the dynamics impacting thermal grease performance,
tests were conducted by users in four different forums using contact
pressure film from Sensor
Products to evaluate thermal
performance as it relates to contact and pressure |
Application
Instructions
IC Diamond has undergone considerable user testing
combined with Innovation Cooling's own studies to optimize
performance along with ease of application. It is highly recommended
that you use our procedure and no others for best
results
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IC Diamond
Reliability
IC Diamond was
originally designed as a high reliability T1 compound for use
between the IHS and CPU. IC Diamond is highly bulk loaded with over
92% micronized diamond particles to limit pump out due to thermal
cycling.
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