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Independent User Thermal
Testing
232 Independent users in seven different forums used their
own PCs to test the difference between IC Diamond and other thermal compounds. This independent
testing shows an average performance gain of 3.21 ºC over other thermal compounds
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Independent User Pressure and Contact Testing
As a continuation of work to
better understand the dynamics
impacting thermal grease performance, tests were conducted by users
in four different forums using contact pressure film from Sensor Products to evaluate thermal performance as it relates
to contact and pressure |
Application
Instructions and
Notes
IC Diamond has undergone considerable user testing combined
with Innovation Cooling's own studies to optimize performance along
with ease of application. It is highly recommended that you use our
procedure and no others for best results
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Reliability
IC Diamond was
originally designed as a high reliability T1 compound for use between
the IHS and CPU. IC Diamond is highly bulk loaded with over 92%
micronized diamond particles to limit pump out due to thermal
cycling.
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