Clean the CPU thoroughly to
remove all previous paste applications completely. Any residue
paste, lint, dust, etc and your results will be adversely
Follow IC Diamond 7 Application
Instructions. Do Not Use other manufactures instructions to apply
as a grain of rice, in a line, etc.
IC Diamond 7 is highly loaded
with diamond particles (92%) and as a consequence its consistency
is very thick. It requires maximum allowable high pressure to
achieve a proper Bond Line Thickness (BLT). A lightly pressure
loaded heatsink will produce a thicker joint which increases
resistance, compromising performance and/or increase cure times.
From our user beta
tests most see an improvement on the initial
installation . In most cases, improved performance is
indicated by total force loads above 45 lbs, averaging 53.6 lbs.
Those that had high force but did no see a result were resolved to
be poor mating contact in which the pressure loads were biased so
that only a small area while having high pressure the actual
contact area was minor. Those that enjoyed the best result had
both high contact and high pressure. The contact images show
broad, even contact with few high spots: Lapping the IHS and heat
sink for better contact may be required to see full performance as
well as adjusting the mount for for increased