Technical/Troubleshooting Note:

As most experienced users understand that when troubleshooting thermal problems there are usually 3 areas of concern.

1.) Pressure
2.) Contact
3.) Application

Taking a thermal measurement on it's own is not enough without a relative basis of comparison. Application and use of thermal compound is a mechanical function though many electronically oriented people tend to attach little importance to mechanical measurements.

Every thermal compound has it's own unique ideal pressure/thermal performance curve. A highly liquid retail compound with great contact resistance will test well at low or moderate pressures as they hit their Bond line thickness (BLT) or average thickness relatively easily but since they are at optimum at these lower pressures adding more pressure fails to yield much of an improvement.

IC Diamond is of a much higher viscosity and has a very different pressure/ performance curve than a more liquid retail compound so at lower pressures and/or contact thermal results maybe equal or less. In paste reviews the major failure is in quantifying the mechanical aspects of what is being tested, are they @ 35lbs and 50% contact area? or 60lbs 60% contact? And how does that relate to multiple thermal/performance pressure curves of different compounds?

Note: 80% of sampled retail sinks were over 50lbs psi

Quantifying mechanical's is not realistic for the individual user but they get around that by observing multiple user results to mentally average a comparison unlike the individual anecdotal test they have a reference point(s) more or less like we are doing here providing samples for comparison.

We generated the attached charts Below from some forum user tests done awhile ago.

What they show is what most know already - that good C/P provides a good thermal result. What it also shows is that IC Diamond performance margins increase with over 50 psi force and with good contact margins are higher. Pressure is dominant and contact will increase with pressure.



Data point # 2 has weak pressure and poor contact resulting in a + 3.7C increase in temps over the liquid paste. Data point # 10 with great contact and pressure shows a -5C improvement over the more liquid compound. This is a nontrivial approx 9C spread and pretty well explains why people get different results.

Also observe Point # 6 it has a somewhat lower pressure but a higher contact hence the improved thermal

So to optimize your thermal result, apply enough compound, tighten your sink and do some lapping

Clean the CPU thoroughly to remove all previous paste applications completely. Any residue paste, lint, dust, etc and your results will be adversely affected.

Follow IC Diamond 7 Application Instructions. Do Not Use other manufactures instructions to apply as a grain of rice, in a line, etc.

IC Diamond 7 is highly loaded with diamond particles (92%) and as a consequence its consistency is very thick. It requires maximum allowable high pressure to achieve a proper Bond Line Thickness (BLT). A lightly pressure loaded heatsink will produce a thicker joint which increases resistance, compromising performance and/or increase cure times.

From our user beta tests most see an improvement on the initial installation . In most cases, improved performance is indicated by total force loads above 45 lbs, averaging 53.6 lbs. Those that had high force but did no see a result were resolved to be poor mating contact in which the pressure loads were biased so that only a small area while having high pressure the actual contact area was minor. Those that enjoyed the best result had both high contact and high pressure. The contact images show broad, even contact with few high spots: Lapping the IHS and heat sink for better contact may be required to see full performance as well as adjusting the mount for for increased pressure.